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? 2004 microchip technology inc. ds21419c-page 1 tc4420/tc4429 features ? latch-up protected: will withstand >1.5a reverse output current logic input will withstand negative swing up to 5v esd protected: 4 kv matched rise and fall times: - 25 ns (2500 pf load) high peak output current: 6a wide input supply voltage operating range: - 4.5v to 18v high capacitive load drive capability: 10,000 pf short delay time: 55 ns (typ.) cmos/ttl compatible input low supply current with logic ? 1 ? input: -450a (typ.) low output impedance: 2.5 ? output voltage swing to within 25 mv of ground or v dd space-saving 8-pin soic and 8-pin 6x5 dfn packages applications switch-mode power supplies motor controls pulse transformer driver class d switching amplifiers general description the tc4420/tc4429 are 6a (peak), single-output mosfet drivers. the tc4429 is an inverting driver (pin-compatible with the tc429), while the tc4420 is a non-inverting driver. these drivers are fabricated in cmos for lower power and more efficient operation versus bipolar drivers. both devices have ttl/cmos compatible inputs that can be driven as high as v dd + 0.3v or as low as ?5v without upset or damage to the device. this eliminates the need for external level-shifting circuitry and its associated cost and size. the output swing is rail-to-rail, ensuring better drive voltage margin, especially during power-up/power-down sequencing. propagational delay time is only 55 ns (typ.) and the output rise and fall times are only 25 ns (typ.) into 2500 pf across the usable power supply range. unlike other drivers, the tc4420/tc4429 are virtually latch-up proof. they replace three or more discrete components, saving pcb area, parts and improving overall system reliability. package types (1) 5-pin to-220 v dd gnd input gnd output tc4420 tc4429 ta b i s common to v dd 8-pin cerdip/ 1 2 3 4 v dd 5 6 7 8 output gnd v dd input nc gnd output tc4420 tc4429 tc4420 tc4429 v dd output gnd output pdip/soic note 1: duplicate pins must both be connected for proper operation. 2: exposed pad of the dfn package is electrically isolated. 8-pin dfn (2) v dd input nc gnd 2 3 4 5 6 7 8 1 tc4420 tc4429 v dd output gnd output tc4420 tc4429 v dd output gnd output 6a high-speed mosfet drivers
tc4420/tc4429 ds21419c-page 2 ? 2004 microchip technology inc. functional block diagram effective input tc4420 output input gnd v dd 300 mv 4.7v c = 38 pf tc4429 500 a non-inverting inverting
? 2004 microchip technology inc. ds21419c-page 3 tc4420/tc4429 1.0 electrical characteristics absolute maximum ratings? supply voltage ..................................................... +20v input voltage .................................. ? 5v to v dd + 0.3v input current (v in > v dd )................................... 50 ma power dissipation (t a 70c) 5-pin to-220 .................................................... 1.6w cerdip ....................................................... 800 mw dfn ............................................ ................... note 2 pdip ............................................................ 730 mw soic............................................................ 470 mw package power dissipation (t a 25c) 5-pin to-220 (with heatsink) ........................ 12.5w thermal impedances (to case) 5-pin to-220 r j-c ...................................... 10c/w ? stresses above those listed under ?absolute maximum ratings? may cause permanent da mage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the spec ifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, t a = +25c with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 1.8 ? v logic ? 0 ?, low input voltage v il ?1.30.8v input voltage range v in ?5 ? v dd +0.3 v input current i in ?10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance, high r oh ?2.12.8 ? i out = 10 ma, v dd = 18v output resistance, low r ol ?1.52.5 ? i out = 10 ma, v dd = 18v peak output current i pk ?6.0?av dd = 18v latch-up protection withstand reverse current i rev ? > 1.5 ? a duty cycle 2%, t 300 sec switching time (note 1) rise time t r ?2535ns figure 4-1 , c l = 2,500 pf fall time t f ?2535ns figure 4-1 , c l = 2,500 pf delay time t d1 ?5575ns figure 4-1 delay time t d2 ?5575ns figure 4-1 power supply power supply current i s ? ? 0.45 55 1.5 150 ma a v in = 3v v in = 0v operating input voltage v dd 4.5 ? 18 v note 1: switching times ensured by design. 2: package power dissipation is dependent on the copper pad area on the pcb.
tc4420/tc4429 ds21419c-page 4 ? 2004 microchip technology inc. dc characteristics (over ope rating temperature range) temperature characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input voltage range v in ?5 ? v dd + 0.3 v input current i in ?10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance, high r oh ?35 ? i out = 10 ma, v dd = 18v output resistance, low r ol ?2.35 ? i out = 10 ma, v dd = 18v switching time (note 1) rise time t r ?3260ns figure 4-1 , c l = 2,500 pf fall time t f ?3460ns figure 4-1 , c l = 2,500 pf delay time t d1 ?50100ns figure 4-1 delay time t d2 ?65100ns figure 4-1 power supply power supply current i s ? ? 0.45 60 3 400 ma a v in = 3v v in = 0v operating input voltage v dd 4.5 ? 18 v note 1: switching times ensured by design. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70c specified temperature range (i) t a ?25 ? +85 c specified temperature range (e) t a ?40 ? +85 c specified temperature range (v) t a ?40 ? +125 c maximum junction temperature t j ? ? +150 c storage temperature range t a ?65 ? +150 c package thermal resistances thermal resistance, 5l-to-220 ja ?71?c/w thermal resistance, 8l-cerdip ja ?150?c/w thermal resistance, 8l-6x5 dfn ja ? 33.2 ? c/w typical four-layer board with vias to ground plane. thermal resistance, 8l-pdip ja ?125?c/w thermal resistance, 8l-soic ja ?155?c/w
? 2004 microchip technology inc. ds21419c-page 5 tc4420/tc4429 2.0 typical performance curves note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: propagation delay time vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: supply current vs. capacitive load. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 579111315 supply voltage (v) c = 2200 pf l 120 100 80 60 40 20 0 time (nsec) c = 4700 pf l c = 10,000 pf l v = 12v dd v = 5v dd 60 40 20 10 1000 10,000 capcitive load (pf) v = 18v dd 80 100 time (nsec) 50 40 30 20 10 0 ?60 ?20 20 60 100 140 t a (c) delay time (nsec) d1 t d2 t c = 2200 pf l v = 18v dd 57 9111315 supply voltage (v) c = 2200 pf l time (nsec) c = 4700 pf l c = 10,000 pf l 100 80 60 40 20 0 60 40 20 10 1000 10,00 0 capacitive load (pf) time (nsec) v = 18v dd 80 100 v = 12v dd v = 5v dd 0 100 1000 10,000 capacitive load (pf) supply current (ma) 84 70 56 42 28 14 0 500 khz 200 khz 20 khz v = 15v dd
tc4420/tc4429 ds21419c-page 6 ? 2004 microchip technology inc. note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-7: rise and fall times vs. temperature. figure 2-8: propagation delay time vs. supply voltage. figure 2-9: supply current vs. frequency. figure 2-10: high-state output resistance vs supply voltage. figure 2-11: effect of input amplitude on propagation delay. figure 2-12: low-state output resistance vs. supply voltage. ?60 ?20 20 60 100 140 t a (c) t rise t 50 40 30 20 10 0 time (nsec) c = 2200 pf v = 18v dd fall l 65 60 55 50 45 40 35 delay time (nsec) 4 6 8 1012141618 supply voltage (v) t d2 t d1 100 0 0 100 1000 10,000 frequency (khz) supply current (ma) 10 1000 18v 10v 5v c = 2200 pf l 5 4 3 2 5913 supply voltage (v) r ( ) ? out 100 ma 50 ma 10 ma 7111 5 200 160 120 80 40 0 delay time (nsec) 567 11 13 15 load = 2200 pf input 2.4v input 3v input 5v input 8v and 10v 8 9 10 12 14 v (v) dd 2.5 2 1.5 1 5913 supply voltage (v) r ( ) ? out 100 ma 50 ma 10 ma 71115
? 2004 microchip technology inc. ds21419c-page 7 tc4420/tc4429 note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-13: crossover energy. 4 3 2 1 0 crossover area (as) x 10 -8 567 11 13 15 8 9 10 12 14 supply voltage (v) the values on this graph represent the loss seen by the driver during one complete cycle. for a single transition, divide the value by 2.
tc4420/tc4429 ds21419c-page 8 ? 2004 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 18v with respect to the ground pins. the v dd input should be bypassed to ground with a local ceramic capacitor. the value of the capacitor should be chosen based on the capacitive load that is being driven. a minimum value of 1.0 f is suggested. 3.2 control input the mosfet driver input is a high-impedance, ttl/cmos compatible input. the input circuitry of the tc4420/tc4429 mosfet driver also has a ?speed- up? capacitor. this helps to decrease the propagation delay times of the driver. because of this, input signals with slow rising or falling edges should not be used, as this can result in double-pulsing of the mosfet driver output. 3.3 cmos push-pull output the mosfet driver output is a low-impedance, cmos, push-pull style output capable of driving a capacitive load with 6.0a peak currents. the mosfet driver output is capable of withstanding 1.5a peak reverse currents of either polarity. 3.4 ground the ground pins are the return path for the bias current and the high peak currents that discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 exposed metal pad the exposed metal pad of the 6x5 dfn package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board (pcb) to aid in heat removal from the package. pin no. 8-pin cerdip/ pdip/soic pin no. 8-pin dfn pin no. 5-pin to-220 symbol description 11?v dd supply input, 4.5v to 18v 2 2 1 input control input, ttl/cmos compatible input 3 3 ? nc no connection 4 4 2 gnd ground 5 5 4 gnd ground 6 6 5 output cmos push-pull output 7 7 ? output cmos push-pull output 883 v dd supply input, 4.5v to 18v ?pad? ncexposed metal pad ??tabv dd metal tab is at the v dd potential
? 2004 microchip technology inc. ds21419c-page 9 tc4420/tc4429 4.0 applications information figure 4-1: switching time test circuits. inverting driver non-inverting driver input t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 ns output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% +18v 0v 90% 10% 10% 10% 90% +5v +18v 0v 0v 0v 90% 26 7 5 4 18 c l = 2,500 pf 0.1 f 4.7 f input v dd = 18v output 0.1 f note: pinout shown is for the pdip, soic, dfn and cerdip packages. tc4429 tc4420
tc4420/tc4429 ds21419c-page 10 ? 2004 microchip technology inc. 5.0 packaging information 5.1 package marking information legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard otp marking consists of microchip part number, year code, week code, and traceability code. 5-lead to-220 xxxxxxxxx xxxxxxxxx yywwnnn example: tc4420cat 0419256 8-lead cerdip (300 mil) example: xxxxxxxx xxxxxnnn yyww tc4420 mja256 0419 8-lead dfn example : xxxxxxx xxxxxxx xxyyww nnn tc4420 emf 0419 256
? 2004 microchip technology inc. ds21419c-page 11 tc4420/tc4429 package marking information (continued) xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc4420 cpa256 0419 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn tc4420 eoa0419 256
tc4420/tc4429 ds21419c-page 12 ? 2004 microchip technology inc. 5-lead plastic transistor outline (at) (to-220) l h1 q e b e1 e c1 j1 f a d a (5x) ?p ejector pin e3 drawing no. c04-036 notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" (0.254mm) per side. jedec equivalent: to-220 *controlling parameter mold draft angle lead width lead thickness a c1 b .014 dimension limits overall height lead length overall width lead pitch a l e .540 min e units .060 inches* .022 0.36 0.56 millimeters .190 .560 13.72 min max 4.83 14.22 max .160 4.06 3 7 3 7 overall length d 1.02 0.64 .040 .025 overall lead centers e1 .263 .385 .560 .273 6.68 6.93 .072 1.52 1.83 .415 9.78 10.54 .590 14.22 14.99 through hole diameter p .146 .156 3.71 3.96 j1 base to bottom of lead .090 2.29 .115 2.92 through hole center q .103 2.87 .113 2.62 flag thickness f .045 1.40 .055 1.14 flag length h1 .234 6.55 .258 5.94 space between leads e3 .030 1.02 .040 0.76
? 2004 microchip technology inc. ds21419c-page 13 tc4420/tc4429 8-lead ceramic dual in-line ? 300 mil (ja) (cerdip) 10.16 9.15 8.13 .400 .360 .320 eb overall row spacing 0.51 0.46 0.41 .020 .018 .016 b lower lead width 1.65 1.40 1.14 .065 .055 .045 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 5.08 4.13 3.18 .200 .163 .125 l tip to seating plane 10.16 9.78 9.40 .400 .385 .370 d overall length 7.62 6.73 5.84 .300 .265 .230 e1 ceramic pkg. width 8.13 7.75 7.37 .320 .305 .290 e shoulder to shoulder width 1.02 0.77 0.51 .040 .030 .020 a1 standoff 5.08 4.57 4.06 .200 .180 .160 a top to seating plane 2.54 .100 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units jedec equivalent: ms-030 drawing no. c04-010 *controlling parameter 1 2 d n e1 c eb e p l a2 b b1 a a1
tc4420/tc4429 ds21419c-page 14 ? 2004 microchip technology inc. 8-lead plastic dual flat no lead package (mf) 6x5 mm body (dfn-s) ? saw singulated
? 2004 microchip technology inc. ds21419c-page 15 tc4420/tc4429 8-lead plastic dual in-line (pa) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 mold draft angle bottom 5 10 15 5 10 15 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
tc4420/tc4429 ds21419c-page 16 ? 2004 microchip technology inc. 8-lead plastic small outline (oa) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2004 microchip technology inc. ds21419c-page 17 tc4420/tc4429 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tc4420: 6a high-speed mosfet driver, non-inverting tc4429: 6a high-speed mosfet driver, inverting temperature range: c = 0c to +70c (pdip, soic, and to-220 only) i = -25c to +85c (cerdip only) e = -40c to +85c v = -40c to +125c package: at = to-220, 5-lead (c-temp only) ja = ceramic dual in-line (300 mil body), 8-lead (i-temp only) mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) pa = plastic dip (300 mil body), 8-lead oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) pb free g = lead-free device * = blank * available on selected packa ges. contact your local sales representative for availability part no. x xx package temperature range device examples: a) tc4420cat: 6a high-speed mosfet driver, non-inverting, to-220 package, 0c to +70c. b) tc4420eoa: 6a high-speed mosfet driver, non-inverting, soic package, -40c to +85c. c) tc4420vmf: 6a high-speed mosfet driver, non-inverting, dfn package, -40c to +125c. a) tc4429cat: 6a high-speed mosfet driver, inverting, to-220 package, 0c to +70c b) tc4429epa: 6a high-speed mosfet driver, inverting, pdip package, -40c to +85c c) tc4429vmf: 6a high-speed mosfet driver, inverting, dfn package, -40c to +125c xxx tape and reel x pb free data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc4420/tc4429 ds21419c-page 18 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21419c-page 19 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. no representation or warranty is given and no liability is assumed by microchip technol ogy incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of micr ochip?s products as critical components in life support syst ems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or ot herwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance ar e trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2004, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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